Features：Gold Finger Plating, HDI First-Order, 8-Layer ENIG

Applications：Power Energy

Features：HDI Second-Order, Multi-BGA Design, 6-Layer ENIG

Applications：Smart Home

Features：Thick Copper, HDI First-Order, 6-Layer ENIG

Applications：Automotive Electronics

Features：Thick Copper, HDI First-Order, 8-Layer ENIG

Applications：Automotive Electronics

Features：Thick Copper, HDI First-Order, 6-Layer ENIG

Applications：Automotive Electronics

Features：Thick Copper, HDI Second-Order, 6-Layer ENIG

Applications：Automotive Electronics

Features：Multi-BGA Design, Multi-Impedance Design, HDI First-Order, 8-Layer ENIG

Applications：Automotive Electronics

Features：HDI First-Order, Side Electroless Copper Plating, Red Solder Mask, ENIG

Applications：Consumer Office

Features：HDI First-Order, Side Electroless Copper Plating, Multi-BGA Design, 6-Layer ENIG

Applications：Smart Home

Features：HDI Second-Order, Multi-BGA Design, Trace Width 0.05mm, 10-Layer OSP

Applications：Consumer Office

Features：HDI First-Order, Coil Board, Precision Engraving, Beveling, Immersion Tin

Applications：Industrial Control / Medical / EMS

Features：HDI First-Order, Multi-BGA Design, Multi-Impedance Design

Applications：Industrial Control / Medical / EMS